On August 16, 2007, TongFu Microelectronics Co., Ltd. which was established in October 1997，became a listed company in Shenzhen Stock Exchange. The stock name is “TongFuWeiDian” with code 002156. The company has 2 major shareholders. One is Nantong Huada Microelectronics Group Ltd. (holding 31.25%) and the other is Fujitsu (China) Limited (holding 21.38%). There are 972,630,000 shares in total possessed by the company.
TFME is a corporation specializing in IC assembling and testing, and is China top three IC Package and Test Enterprise. In 2016, TFME ranked 8th globally. The headquarter is located in Chongchuan Zone, Nantong, Jiangsu Province. TFME have 6 production base: Headquarter、 Nantong Tongfu, Hefei Tongfu, TF-AMD Suz, TF-AMD Penang, Xiamen Tongfu. Through development and acquisition, TFME has become the local semiconductor multinational corporation and the leader of China IC Package and Test Industry. At present, there are more than 10,000 employees.
At present, TFME owns several packaging technique such as: Advanced Package& Test technology such as Bumping、WLCSP、FC、BGA、SiP etc.，Traditional Package& Test technology such as QFN、QFP、SO etc.，Automotive Electronics Products and MEMS etc.; Testing technique such as: Wafer Test and System Test. Among domestic package and test corporations, TFME is the first one to realize the mass production of 12inch 28nm mobile phone processor chip backend process, including Bumping、CP、FC、FT、SLT and so on. More than 50% of global top ten semiconductor manufacturers are our major customers.
TFME has several high-level R&D platform such as National Enterprise Technology Center, National Postdoctoral Scientific Research Station, Jiangsu Enterprise Academician Work Station, Provincial Engineering and Technological Research Center and Enterprise research institute. TFME also has a professional technical team formed by more than 2000 people.
As a national and provincial high technology corporation, TFME always stands in the forefront of industry science and technology development, and adheres to the idea of achieving improvement with science and technology. During the past years, TFME has undertaken and completed many national and provincial technological reform projects, such as “02 Special Project”, and got national special funds which worth several billions. Dozens of product technology have been awarded as China Semiconductor Innovative Product and Technology、National Key product、Jiangsu Province High-tech Product and Jiangsu Province Science and Technology awards etc.
Much earlier than its rivals, the company also passed three international management system certifications, including ISO9001, ISO14001 & ISO/TS16949. By using SAP、MES、Equipment Automation、EDI etc., TFME can communicate with customer in real time as per customer’s personalized standard auto-control productive process. Through implementing “TFME Industry 4.0” Project, entirely build the smart plant based on Internet of Things and set up the flexible automation assembly line. Thus, we can create a Win-Win situation for the clients.
The company was established in October of 1997. At present, there are more than 4000 employees. As a national and provincial high technology corporation, TFME always stands in the forefront of industry science and technology development, and adheres to the idea of achieving improvement with science and technology. During the past years, TFME has undertaken and completed many national and provincial technological reform projects, which effectively promoted the industrialization of advanced assy & test technologies in China. Much earlier than its rivals, the company also passed three international management system certifications, including ISO9001, ISO14001 & ISO/TS16949.
CopyRight 2015 All Right Reserved Tongfu Microelectronics Co., Ltd.
Address: Jiangsu province Nantong City Road, No. 288 Telephone：0513-85058888 Fax：0513-85058868