BGA series

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Production Overview
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
NFME offers BGA packages with ball counts up to 3000.
 
Application
BGA packages are considered one of the most established industry standard packages. BGA is commonly used in networking, memory, microprocessors, graphic processors and micro-controllers. ASIC, gate arrays found in applications such as automotive, consumer, communications and networking products.

Reliability Test Standards
The test criterion is zero defect out of 77 sampling units.
JEDEC Precondition :J-STD-20/JESD22-A113

Temp/Humidity Test

85°C/ 85% RH, JEDEC 22- A101

Pressure Cooker Test

121°C/ 100% RH/ 15 PSIG, JEDEC 22- A102

Temp Cycle Test

-65 ~ 150°C, JEDEC22-A104

High Temp Storage Test

150°C, JEDEC 22- A103

High Accelerated Stress Test

130°C/ 85% RH/ 33.5 PSIA, JEDEC 22- A110/A118


Design Rule
Minimum Ink Size:                    20mil (500 um) diameter or non-ink with wafer mapping
Maximum Ink Height:                1mil (25um)
Minimum Sawing street width: 45um
Wafer Thickness:                      Back grinding is required if the thickness exceeds NFME spec.
Package size:                            1x1mm to 21x21mm
Substrate Layer:                       1 - 6 Layer

Package type

Package size

Wafer thickness

BGA

all

2mil Min (after BG)


Wire Bond Rule

Wire size

Min. bond pad pitch

Min. bond pad opening

Wire loop control

50um (2.0mil)

200um

150um

Max. wire length/loop height

7000um/<300um

38um (1.5mil)

150um

120um

Max. wire length/loop height

5500um/<300um

33um (1.3mil)

120um

100um

Max. wire length/loop height

5500um/<300um

30um (1.2mil)

100um

80um

Max. wire length/loop height

5500um/<300um

25um (1.0mil)

64um

58um

Max. wire length/loop height

5500um/<300um

23um (0.9mil)

60um

55um

Max. wire length/loop height

4000um/<300um

20um (0.8mil)

52um

48um

Max. wire length/loop height

4000um/<300um

17.5um (0.7mil)

44um

40um

Max. wire length/loop height

3600um/<300um


Packing & Shipping


BGA (Tray)/Tape&Reel


PKG TYPE

Body Size(mm)

QTY/Tray

Tray/Inner Box

BGA

4*4

490

10+1(bank)

BGA

4.6*4.6

490

10+1(bank)

BGA

5*5

490

10+1(bank)

BGA

5.1*5.1

490

10+1(bank)

BGA

5.3*5.1

434

10+1(bank)

BGA

5.8*5.8

490

10+1(bank)

BGA

6*10

294

10+1(bank)

BGA

7*7

260

10+1(bank)

BGA

7.1*7.1

260

10+1(bank)

BGA

8*8

260

10+1(bank)

BGA

9*9

168

10+1(bank)

BGA

10*10

184

10+1(bank)

BGA

10*12

128

10+1(bank)

BGA

11.6*12.1

136

10+1(bank)

BGA

12*12

189

10+1(bank)


Note: Please contact the sales office for other options. 




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